February 05, 2016

ACADEMIC SCAM: Bogus conference publishes its proceedings with World Scientific

Aggressive SPAM from a Bogus conference.
Check it. The Bogus Conference publishes is proceedings with the Fake Pseudo-Science Publisher WORLD SCIENTIFIC (Singapore)




Official Website: http://www .csta2016. org/
Conference Date: 18th - 20th, March, 2016
Submission Deadline: March 5th, 2016

Topics
Software Testing and Tools
Database, Data Warehousing, Data Engineering
Artificial Intelligence, Neural Networks and Genetic Algorithms
Image Processing & Pattern Recognition 
(For more information, please check the official website)

Technical Program Committee
Dr. Jiading Feng, Shandong Agricultural University, China
Dr. Dongxuan Cui, Changchun University of Science and Technology, China
Dr. Ning Wan, Northeast Agricultural University, China
Dr. Fanchou Wu, Shanghai University Of Electric Power, China
Dr. Qin Zheng, North University Of China, China
Dr. Zhihui Sun, Polytechnic School Of Shenyang Ligong University, China
Dr. Kunhao Zhou, Taiyuan Institute Of Technology, China
Dr. Xueqing Wang, North China Institute Of Aerospace Engineering, China
Dr. Linshan Fang, Beijing Institute of Technology, China
Dr. Mu He, Northeast Agricultural University, China
Dr. Chuwei Ren, Hubei Engineering University, China
Dr. De Yan, North University Of China, China

About 20 - 30 excellent papers will be selected to submit for SCI index.
Notice: please write down your phone number in email when you submit your papers.

Submission


February 12, 2014

SPAM from World Scientific. Aggressive Spam from this extremely predatory publisher

 
Polymer Tribology

edited by Sujeet K Sinha (National University of Singapore, Singapore) & Brian J Briscoe(Imperial College London, UK)hardcover:
US$284 / £187 / S$375
US$213 / £140.25 / S$281.25
ebook:
US$213 / £140 / S$281
US$159.75 / £105 / S$210.75

till 28 February 2014
Discount code:

WSGOLD25
 SPAM from World Scientific. Aggressive Spam from this extremely predatory publisher

SPAM from World Scientific. Aggressive Spam from this extremely predatory publisher

Bogus Publications. Fake Conferences from WORLDSCIENTIFIC

SPAM from World Scientific. Aggressive Spam from this extremely predatory publisher
This book deals with the new and now-expanding field of friction, wear, and other surface-related mechanical phenomena for polymers. Polymers have been used in various forms such as bulk, films, and composites in applications where their friction, wear resistance, and other surface-related properties have been effectively utilized. There are also many examples in which polymers have performed extremely well, such as in tyres, shoes, brakes, gears, bearings, small moving parts in electronics and MEMS, cosmetics/hair products, and artificial human joints. Around the world, much research is currently being undertaken to develop new polymers, in different forms, for further enhancing tribological performance and for finding novel applications. Keeping in view the importance of tribology of polymers for research and technology as well as the vast literature that is now available in research papers and review articles, this timely book brings together a wealth of research data for an understanding of the basic principles of the subject.» more
People who read this title were also interested in:

Polymer Thin Films

Nanosols And Textiles

In-Situ Electron Microscopy At High Resolution

Useful Quasicrystals
 
 
  
      How to Order
  • An ordering guide can be found here.
  • Prices are subject to change without prior notice.
  • This promotion is available only to individuals purchasing directly from World Scientific's web site. It is not available to libraries and booksellers.
  • Not available in India and SAARC countries
  • Promotion is valid while stocks last. Delivery may be delayed up to 2 months due to high demand.
  • S$ price is valid for Singapore and China markets only.
To unsubscribe, please click the link found at the bottom of the email, alternatively, please notify us at unsub@wspc.com
Copyright © 2014 World Scientific Publishing Co. All rights reserved.

SPAM from the Bogus Company IGI-Publishers. No review at all. Just a commercial enterprize with one target: The profit

SPAM from the Bogus Company IGI-Publishers. No review at all. Just a commercial enterprize with one target: The profit

SPAM from the Bogus Company IGI-Publishers. No review at all. Just a commercial enterprize with one target: The profit

Tag: Fake Publications. Fake Academics. Spam Publishers. Bogus Books. Predatory Publishers
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December 21, 2012

Typical SPAM from typical bogus conference



Dear Author,
The 2013 International Conference on Applied Science,Engineering and Technology(ICASET 2013) will be held in Qingdao, September 20-22, 2013. The objective of this Conference is to offer a meeting point for professionals and researchers from industry and academia to present and discuss recent advances in the field of Applied Science, Information Technology, Materials Science, Chemistry, Electronic Engineering, Biological Technology etc.

Call for papers
(I) Chemical Engineering and Technology 
(II) Advances in Chemistry Research
(III) Material Science and Engineering
(IV)Computer Science and Technology
(V) Electronics and Information Technology
(VI) Management Science and Engineering 

会议网站:http://www.atmrc.org/icaset/
本次会议由于版面有限,论文将采取早注册、早提交检索的模式对论文进行出版。争取会前被EI检索。
  

After refereeing process, all accepted paperswill be combined into the conference proceedings, and be published in periodical AMR of TTP Advanced Materials Research, ISSN:1022-6680 )and will be indexed in the major academic databases, including EI Compendex, Thomson ISI (ISTP), and other indexing services.(See TTP's Conference List ID:787 ). AMR Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. The full text is online available via platformwww.scientific.net. Selected excellent paperswill be published on international reputation SCI journals.

本次会议TTP出版社出版列表 : ID:787
审稿周期:2周内
投稿邮箱:icaset@163.com


IADIS: Bogus Conferences - Bogus Journals - Fake and Bogus IADIS

IADIS is well known bogus publisher and organizer of several bogus journals. Imagine what? They sent SPAM (see below) looking for committee members, reviewers in a pyramid scheme. See below the IADIS bogus email and draw your own conclusions:

Dear Colleague,

We are co-chairing the (bogus) IADIS Multi Conference on Computer Science and Information Systems (MCCSIS 2013), a conference made of 13 conferences in the broad areas of Computer Science and Information Systems (please see http://www.mccsis.org).
Following your last year participation as member of the Program Committee of Web Based Communities and Social Media, I would like to re-invite you to take part in this year's edition (please see http://www.webcommunities-conf.org/).

If you agree, we would like to ask you to access the reviewer's (bogus)  web site at http://www.conf-system.org/confman_wbc2013/index_reviewer.asp (see your login and password at the bottom of this email) in order to choose your areas of interest/expertise so that we can assign you some papers for review - please choose at least a minimum of 3 areas. Can you do this within the next days?


As a member of the (bogus) committee, you will get some (bogus) papers to review in the topics you select (topics list available athttp://www.webcommunities-conf.org/call-for-papers). You are entitled to be part of the (bogus) proceedings book and (bogus) CD-ROM.

Can I just ask you for a couple of names that could also be part of this (bogus) committee? The idea is to increase the number of members in the (bogus) committee in order to reduce the committee members' workload.

Also, can you please send me your address so that we can send you a (bogus) CD-ROM with the proceedings of the 2013 edition?

Could you please let me know whether you accept this (bogus) invitation?

Hope to see you again being part of this (bogus) IADIS conference.

Best regards,
Piet Kommers, University of Twente, The Netherlands
(bogus) IADIS WBC 2013 Program Chair


Piet Kommers, University of Twente, The Netherlands
Pedro Isaías, Universidade Aberta (Portuguese Open University), Portugal
Eva Kasparova, University of Business Administration, Prague, Czech Republic
MCCSIS 2013 General Conference Co-Chairs

************************************************************
********
Apologies for cross-postings. Please send to interested colleagues and students

November 28, 2012

New Spam from IEEE *New Spam from IEEE *New Spam from IEEE *

New Spam from IEEE *New Spam from IEEE *New Spam from IEEE *New Spam from IEEE *

We got the following IEEE Spam. You can find several IEEE fake conferences (bogus conferences of IEEE) using Google search engine.

New Spam from IEEE *Call for Papers
=================
IEEE Journal on Emerging and Selected Topics in Circuits and Systems
Special Issue on Computational and Smart Cameras

New Spam from IEEE *Scope and Purpose
===================
The IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) seeks original contributions for an
issue on computational and smart cameras, scheduled to appear in June 2013.
Technological developments in imaging, computation, and embedded systems have created an opportunity for multi-
disciplinary approaches to techniques and applications related to cameras. They are no longer merely devices to record
a particular scene in a 2D picture; instead, with novel designs of the imaging systems, together with powerful
computation and interconnections among multiple cameras, many new applications in photography, vision, and sensing
are now possible.

New Spam from IEEE *Topics of Interest
====================
Topics of interest for this issue include, but are not limited to:
 -  Circuits and systems for camera designs and architectures
 -  Image sensing and processing for smart cameras
 -  Computational cameras
 -  Computational illumination, optics, and electronic design
 -  High-performance imaging and in-camera image processing
 -  Embedded vision programming and parallel systems
 -  Wireless and mobile camera networks
 -  Camera arrays, and cameras based on cellular networks
 -  Distributed capture and vision processing algorithms
 -  3D scene capture, storage, and analysis
 -  Multi-view vision algorithms and applications
 -  Image processing with computational and energy constraints

New Spam from IEEE *Guest Editors
===============
Edmund Lam, University of Hong Kong : elam@ieee.org
Hamid Aghajan, Stanford University : aghajan@stanford.edu
Andrea Prati, Università Iuav di Venezia : aprati@iuav.it
Faisal Qureshi, University of Ontario Institute of Technology : Faisal.Qureshi@uoit.ca
Vincent Tam, University of Hong Kong : vtam@eee.hku.hk